CMXD2004TO TR PBFREE

CMXD2004TO SURFACE MOUNT TRIPLE ISOLATED OPPOSING HIGH VOLTAGE SILICON SWITCHING DIODES SOT-26 CASE MAXIMUM RATINGS: (TA=25°C) Continuous Reverse Voltage Peak Repetitive Reverse Voltage Average Forward Current Continuous Forward Current Peak Repetitive Forward Current Peak Forward Surge Current, tp=1.0μs Peak Forward Surge Current, tp=1.0s Power Dissipation Operating and Storage Junction Temperature Thermal Resistance w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMXD2004TO consists of three (3) Isolated High Voltage Silicon Switching Diodes arranged in an alternating configuration in a SUPERmini SOT-26 surface mount package, and designed for high voltage switching applications. This device can be configured as a 900V switching diode. See optional mounting pad configuration. MARKING CODE: X04TO SYMBOL UNITS VR 240 V VRRM IO 300 V 200 mA IF IFRM IFSM 225 mA 625 mA 4.0 A IFSM PD 1.0 A 350 mW TJ, Tstg ΘJA -65 to +150 °C 357 °C/W ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN MAX IR UNITS BVR VR=240V VR=240V, TA=150°C IR=100μA VF IF=100mA 1.0 V CT VR=0, f=1.0MHz 5.0 pF trr IF=IR=30mA, Irr=3.0mA, RL=100Ω 50 ns IR 100 nA 100 μA 300 V R2 (12-February 2010) CMXD2004TO SURFACE MOUNT TRIPLE ISOLATED OPPOSING HIGH VOLTAGE SILICON SWITCHING DIODES SOT 26 CASE - MECHANICAL OUTLINE PIN CONFIGURATION OPTIONAL MOUNTING PADS For 900V Series Configuration (Dimensions in mm) LEAD CODE: 1) Anode D1 2) Cathode D2 3) Anode D3 4) Cathode D3 5) Anode D2 6) Cathode D1 MARKING CODE: X04TO R2 (12-February 2010) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)